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Demand For IC Resilience Drives Methodology Changes

By: Ann Steffora Mutschler

New ways of connecting design, verification, test, and in-field data are needed for longer lifetimes and more critical applications.

The need is growing for chips that can process more data faster, over longer periods of time, and often within a shrinking power budget. That, in turn, is forcing changes at multiple levels, at the architecture, design, verification, and test phases, each of them bolstered by in-field data analysis that is looped back to add incremental reliability improvements at every step of the flow.


At the end of the day, transformation is happening in terms of how chips and systems are designed, verified, manufactured and managed in field.

“We’re showing the systems companies something they’ve never seen before, and which could not have done before,” proteanTecs Baruch added. “That changes the perspective of what else they can do with that, such as how to improve efficiency and quality. ‘I have a return, an RMA came back, how can I troubleshoot it?’ Before that it was a black box. Now I can get a sense of whether it’s the chip vendor, or maybe not. Maybe it’s my component. So many questions can now be answered. That is what’s transforming this whole industry.”


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